Project overview
The critical importance of capabilities for semiconductor research in the UK is recognized as part of a national strategy, as stressed in the recent BEIS Report 'The semiconductor industry in the UK'. Particular strength in research is centered around a number of cleanroom facilities located at academic institutions. The ¾ÅÉ«ÊÓƵ hosts a range of cutting-edge nanofabrication tools which enable a range of research activities in electronic and photonic devices.
Fabrication of semiconductor devices and circuits becomes cost effective when processed on a large wafer. However, process efficiency can only be achieved if an ultra-high-resolution scanning electron microscope (SEM) with material characterisation system is available to provide high throughput feedback results to improve fabrication and facilitate novel process development. Manually operated SEMs are a common imaging tool for characterisation used in academic research but automated in-line imaging of wafers throughout a process flow is required to achieve fast imaging and shorten inspection time from fabrication processes.
The aim of the proposal is to acquire an ultra-high-resolution SEM (UHR-SEM) capable of material characterisation for wafers up to 200 mm in diameter at the ¾ÅÉ«ÊÓƵ. As device feature sizes are reduced, dimension and performance variations across the wafer become an issue which must be mitigated at the early stage of the fabrication. Therefore, the proposed UHR-SEM will be unique within the UK academic landscape since it will perform automated in-line imaging and analysis of entire wafers up to 200 mm in diameter at sub-nm resolution. The system will also have a low landing voltage on samples to reduce surface damage during imaging of delicate devices and patterned resists, as well as a good depth of focus for the inspection of thick multi-stack materials. The UHR-SEM will address the main challenges in large wafer imaging such as generating relevant surface metrology information at nanoscale dimensions and creating a detailed map showing various material parameters such as chemical composition and defect distribution.
Fabrication of semiconductor devices and circuits becomes cost effective when processed on a large wafer. However, process efficiency can only be achieved if an ultra-high-resolution scanning electron microscope (SEM) with material characterisation system is available to provide high throughput feedback results to improve fabrication and facilitate novel process development. Manually operated SEMs are a common imaging tool for characterisation used in academic research but automated in-line imaging of wafers throughout a process flow is required to achieve fast imaging and shorten inspection time from fabrication processes.
The aim of the proposal is to acquire an ultra-high-resolution SEM (UHR-SEM) capable of material characterisation for wafers up to 200 mm in diameter at the ¾ÅÉ«ÊÓƵ. As device feature sizes are reduced, dimension and performance variations across the wafer become an issue which must be mitigated at the early stage of the fabrication. Therefore, the proposed UHR-SEM will be unique within the UK academic landscape since it will perform automated in-line imaging and analysis of entire wafers up to 200 mm in diameter at sub-nm resolution. The system will also have a low landing voltage on samples to reduce surface damage during imaging of delicate devices and patterned resists, as well as a good depth of focus for the inspection of thick multi-stack materials. The UHR-SEM will address the main challenges in large wafer imaging such as generating relevant surface metrology information at nanoscale dimensions and creating a detailed map showing various material parameters such as chemical composition and defect distribution.
Staff
Lead researchers
Other researchers
Collaborating research institutes, centres and groups
Research outputs
DOI:
Type: article
DOI:
Type: article
DOI:
Type: article